Gearing Up for "Nehalem" Sockets
November 28, 2007 6:31 PM
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Intel partners reveal plans for new processor socket designs
In a memo copied to
, Intel partners recently discussed details regarding Intel's next-generation socket designs.
next-generation processor family
, integrates the memory controller directly onto the processor die -- a feature already standard on AMD's K8 and K10 core architecture.
Where companies traditionally increase pin count for new processor designs, Intel's LGA715 (also dubbed Socket H) will actually decrease the amount of pins from 775 to 715. Since the memory controller will reside on the processor,
processors no longer need the additional signaling from the processor to the Northbridge.
Guidance released to Japanese
claims this new desktop socket will actually utilize a
1160-pin LGA1160 design instead
. Intel officials would not reveal exact pin count details.
LGA1366, on the other hand, will greatly increase the pin-count for cross-CPU communication via Intel's QuickPath Interface. AMD increased its pin-count for server chipsets when it migrated from PGA940 to LGA1207 design last year.
processors will use Registered DDR3 memory; desktop processors will utilize the unregistered variant. While not electrically compatible with DDR2, DDR3 still uses 240 pins for signally thus eliminating the need to increase pins on account of the system memory.
As one Intel engineer who agreed to speak on conditions of anonymity put it, "We try to reduce the pin counts as much as possible to eliminate cross talk and other interference." He adds, "But we do try to leave some pins for overhead and future use."
-based CPUs will use Intel's second-generation land grid array (LGA) design. The use of "pins" in context of the land grid array is a bit of a misnomer as the processor interfaces with the socket design via pads rather than pins. This LGA design is recognized by both AMD and Intel for its ability to increase "pin" density and durability.
Corporate roadmaps from Tyan and Supermicro both detail LGA1366 designs for sampling by the end of Q2 2008. Desktop LGA715 variants, on the other hand, won't see mass production until the second half of 2008, with a target launch of Q4 2008.
Intel guidance slates
chipsets for a Q3 2008 launch
chipsets using the LGA715 design are on the record for Q4 2008.
This article is over a month old, voting and posting comments is disabled
11/29/2007 10:36:29 AM
I hear you. 10 years ago I was on top of all the hardware news and product releases, and I build a couple of systems - for other people ('cause I had no money, being a poor student and all).
Now I could afford a new system, but I'm not even close to making good use of my current gaming rig (S939 4200+, 7900GT). Heck, I didn't even attempt to o/c the 7900 so far, and I have it for more than a year now. I'm currently trying to catch up on HL2 ... playing about 2 hours a week (on a good week). No point of getting a better system, I'd rather get a better monitor at work, where I spend 10+ hours a day. Man, that's so sad ... (/whining)
11/29/2007 11:34:35 AM
I'm not up on all the details myself but I try to keep current. I just upgraded my system to a X2 6000. Seems upgrades are coming every 3 years for me. I'll buy Crysis when I get my 8800GT. Right now I'll stick to the demo as I'm not gaming much anyways (maybe every 3 to 4 months I'll play for 30 minutes to an hour). When I'm finally done with school, then I'll play more. Right now it's just not that important.
"Mac OS X is like living in a farmhouse in the country with no locks, and Windows is living in a house with bars on the windows in the bad part of town." -- Charlie Miller
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