Gearing Up for "Nehalem" Sockets
November 28, 2007 6:31 PM
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Intel partners reveal plans for new processor socket designs
In a memo copied to
, Intel partners recently discussed details regarding Intel's next-generation socket designs.
next-generation processor family
, integrates the memory controller directly onto the processor die -- a feature already standard on AMD's K8 and K10 core architecture.
Where companies traditionally increase pin count for new processor designs, Intel's LGA715 (also dubbed Socket H) will actually decrease the amount of pins from 775 to 715. Since the memory controller will reside on the processor,
processors no longer need the additional signaling from the processor to the Northbridge.
Guidance released to Japanese
claims this new desktop socket will actually utilize a
1160-pin LGA1160 design instead
. Intel officials would not reveal exact pin count details.
LGA1366, on the other hand, will greatly increase the pin-count for cross-CPU communication via Intel's QuickPath Interface. AMD increased its pin-count for server chipsets when it migrated from PGA940 to LGA1207 design last year.
processors will use Registered DDR3 memory; desktop processors will utilize the unregistered variant. While not electrically compatible with DDR2, DDR3 still uses 240 pins for signally thus eliminating the need to increase pins on account of the system memory.
As one Intel engineer who agreed to speak on conditions of anonymity put it, "We try to reduce the pin counts as much as possible to eliminate cross talk and other interference." He adds, "But we do try to leave some pins for overhead and future use."
-based CPUs will use Intel's second-generation land grid array (LGA) design. The use of "pins" in context of the land grid array is a bit of a misnomer as the processor interfaces with the socket design via pads rather than pins. This LGA design is recognized by both AMD and Intel for its ability to increase "pin" density and durability.
Corporate roadmaps from Tyan and Supermicro both detail LGA1366 designs for sampling by the end of Q2 2008. Desktop LGA715 variants, on the other hand, won't see mass production until the second half of 2008, with a target launch of Q4 2008.
Intel guidance slates
chipsets for a Q3 2008 launch
chipsets using the LGA715 design are on the record for Q4 2008.
This article is over a month old, voting and posting comments is disabled
11/28/2007 11:47:15 PM
I am thinking of selling my computers guts and getting a mATX computer...
1. I don't really play that many games, very often, and everything I really want to play is in development for a while
2. My enthusiast motherboard CANNOT get/stay in S3/S1 standby, when will this problem end :(
3. It bleeds power due to idling video card as well as having a nice loud humm
4. I hate my X-Fi and want to smash it into pieces, fix your damn software already
11/29/2007 12:44:41 PM
I bet you're using vista, aren'tcha?
11/30/2007 1:42:28 PM
No :( XP on my desktop, but Vista doesn't work either (Have tried RTM)... Gentoo Works with S1 sometimes. S3 on all OSes I have tested causes the computer to wake up after a few seconds and/or have video never come back up.
Still haven't the X-Fi driver to install cleanly and work on Gentoo.
BTW I think all the standby/resume problems revolve around the 965P-DQ6 being a pile of garbage. I will NEVER buy another Gigabyte product. It is fairly stable but it cannot handle restarts/startups well, or use standby even when not being overclocked.
"Intel is investing heavily (think gazillions of dollars and bazillions of engineering man hours) in resources to create an Intel host controllers spec in order to speed time to market of the USB 3.0 technology." -- Intel blogger Nick Knupffer
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