Gigabyte, ASUS RD790 Boards Surface
October 26, 2007 10:32 AM
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ASUS M3A32-MVP Deluxe WiFi
Gigabyte and ASUS debut new RD790-based boards.
ASUS and Gigabyte both announced boards based on
chipset. The AMD 790FX is the successor to AMD's dated 580X chipset and serves as AMD's new primary single and dual-processor platform. The new boards come with support for AMD's latest features, including compatability with AMD's upcoming Quad-Core desktop Phenom processors.
ASUS officially launched its M3A-MVP Deluxe WiFi, which comes with the latest bells and whistles. Highlights of the board include support for HyperTransport 3.0, 8-channel HD Audio, and Crossfire-support.
The most unique feature of the board, though, is its cooling system. Avid overclockers will be please to know that the board's memory slots come fitted with heatsinks that are connected to the central cooling system. The board's entire cooling system is passive, translating to less overall system noise, and is made of copper.
In addition to ASUS, Gigabyte is also releasing its first RD790 board, the Gigabyte GA-MA790FX-DQ6 Ultra Durable motherboard.
The board features support for AMD AM2+ Phenom desktop processors along with support for AM2 Athlon 64 processors and HyperTransport 3.0. The board also comes with 4 PCIe 2.0 slots, meaning it support ATI CrossFireX multi-GPU technology.
Similar to the M3A-MVP, the GA-MA790FX-DQ6 also comes based on a passive cooling system made out of copper, however, it doesn't include cooling for memory.
Gigabyte will also introduce two slightly cut down version of RD790, the GA-MA790FX-DS5 and the GA-MA780X-DS4. The GA-MA780X-DS4 will only feature a single PCIe x16 lane.
MSI previously also announced its
motherboard. The board supports Triple-Play Technology along with ATI CrossFireX multi-GPU technology.
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RE: memory cooling
10/26/2007 11:02:20 AM
although it does seem like alot of overkill for a 8 watt tdp chipset, I guess it will overclock like a monster
"Intel is investing heavily (think gazillions of dollars and bazillions of engineering man hours) in resources to create an Intel host controllers spec in order to speed time to market of the USB 3.0 technology." -- Intel blogger Nick Knupffer
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