Intel announced Friday that it broke ground on its first 300mm wafer fabrication facility in Asia dubbed simply Fab 68. Intel says Fab 68 will help extend their global manufacturing leadership and help to cultivate local engineering talent.
Intel’s Fab 68 will be located in Dalian, China and is slated to come online in 2010 with construction to begin immediately. The fabrication facility will have 163,000 square meters (about 1,754,517 square feet) of factory space as well as a 15,000 square meter (161,458 square foot) clean room.
Fab 68 is also being built to minimize its impact on the environment as well. Intel says Fab 68 will meet its high standards for water, energy and chemical waste management. As part of the local Dalian talent development process Intel is working with the Dalian University of Technology and the Dalian Municipal Government to establish the Semiconductor Technology Institute with the goal of fostering world-class talent for the IT industry in China and abroad. Part of the plan includes the donation of a 200mm wafer process line to the newly established Semiconductor Technology Institute for training purposes.
Intel says its new Fab 68 will require a total investment of close to $4 billion dollars with $2.5 billion for the fabrication facility alone.
"The scope and scale of our global manufacturing network gives Intel the ability to provide customers with leading-edge, energy-efficient products in high volume," said Craig Barrett, Chairman, Intel Corporation. "Fab 68 will have world-class infrastructure and be an integral part of our global manufacturing network while bringing us closer to our customers and partners in China."
quote: 300 mm = 11.81 inches . Smaller, but not a lot smaller.