backtop


Print


Dr. Craig Barrett, Intel Chairman of the Board, breaks ground with Chinese government officials on Fab 68 in Dalian, China.  (Source: Intel)
Intel's first 300mm wafer fabrication plant being built in Dalian, China

Intel announced Friday that it broke ground on its first 300mm wafer fabrication facility in Asia dubbed simply Fab 68. Intel says Fab 68 will help extend their global manufacturing leadership and help to cultivate local engineering talent.

Intel’s Fab 68 will be located in Dalian, China and is slated to come online in 2010 with construction to begin immediately. The fabrication facility will have 163,000 square meters (about 1,754,517 square feet) of factory space as well as a 15,000 square meter (161,458 square foot) clean room.

Fab 68 is also being built to minimize its impact on the environment as well. Intel says Fab 68 will meet its high standards for water, energy and chemical waste management. As part of the local Dalian talent development process Intel is working with the Dalian University of Technology and the Dalian Municipal Government to establish the Semiconductor Technology Institute with the goal of fostering world-class talent for the IT industry in China and abroad. Part of the plan includes the donation of a 200mm wafer process line to the newly established Semiconductor Technology Institute for training purposes.

Intel says its new Fab 68 will require a total investment of close to $4 billion dollars with $2.5 billion for the fabrication facility alone.

"The scope and scale of our global manufacturing network gives Intel the ability to provide customers with leading-edge, energy-efficient products in high volume," said Craig Barrett, Chairman, Intel Corporation. "Fab 68 will have world-class infrastructure and be an integral part of our global manufacturing network while bringing us closer to our customers and partners in China."

Intel also has plans to retool its Fab 11x in Rio Rancho, New Mexico for 300mm wafer production. Intel will begin their 300mm fabrication for the 45nm wafers in Oregon. Intel is also in the process of building two other 300mm fab facilities in Chandler, Arizona and Kiryat Gat, Israel both scheduled for production in 2008.




"I mean, if you wanna break down someone's door, why don't you start with AT&T, for God sakes? They make your amazing phone unusable as a phone!" -- Jon Stewart on Apple and the iPhone
Related Articles



Latest Headlines
Super Hi- Vision Will Amaze the World
January 16, 2017, 9:53 AM
3 Ryzen Compatible Motherboards
January 12, 2017, 12:01 AM
AMD at CES 2017
January 9, 2017, 12:01 AM
Intel CES 2017
January 7, 2017, 7:00 AM



Most Popular ArticlesSuper Hi- Vision Will Amaze the World
January 16, 2017, 9:53 AM
Samsung Chromebook Plus – Coming in February 2017
January 17, 2017, 12:01 AM
Samsung 2017 Handset’s Updates
January 17, 2017, 12:01 AM
Comparison – Surface Pro VS Tbook X5 Pro
January 21, 2017, 7:00 AM
Comparison – iPad Mini Vs Huawei MediaPad M3
January 19, 2017, 2:08 AM

Latest Blog Posts
Some new News
Saimin Nidarson - Jan 23, 2017, 8:59 AM
What is new?
Saimin Nidarson - Jan 22, 2017, 7:00 AM
News
Saimin Nidarson - Jan 20, 2017, 7:00 AM
News of the World
Saimin Nidarson - Jan 19, 2017, 7:00 AM
Some tips
Saimin Nidarson - Jan 17, 2017, 12:16 AM
News of the Day
DailyTech Staff - Jan 16, 2017, 12:10 PM
Tech News
Saimin Nidarson - Jan 15, 2017, 12:32 AM
Here is Some News
Saimin Nidarson - Jan 14, 2017, 12:39 AM
News around the world
Saimin Nidarson - Jan 12, 2017, 12:01 AM
Rumors and Announcements
Saimin Nidarson - Jan 11, 2017, 12:01 AM
Some news of Day
Saimin Nidarson - Jan 7, 2017, 12:01 AM
News 2017 CES
Saimin Nidarson - Jan 6, 2017, 12:01 AM






botimage
Copyright 2017 DailyTech LLC. - RSS Feed | Advertise | About Us | Ethics | FAQ | Terms, Conditions & Privacy Information | Kristopher Kubicki