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Intel prepares boxed quad-core "Penryn" based Xeon processors for November 11

Intel has set the launch date for its Penryn based quad-core Xeon processor family. The company intends to launch seven new Harpertown based models ranging from 2.0-to-3.16 GHz on November 11, according to a posting on Intel’s reseller webpage. Standard “E” bin and performance “X” bin processors launch on November 11.

Intel Xeon processors carrying the “E” designation feature 80-watt TDP ratings while the “X” bin processors have higher 120-watt TDP ratings. Intel does not plan to launch the low-power “L” models until Q1’08, with two models in the pipeline. 

Strangely, Intel never issued a formal announcement for the launch of Penryn nor has the November 11 date showed up on roadmaps. Instead, the launch date popped up on a public webpage for resellers.

Penryn Quad-Core Xeon DP

L2 Cache
Launch Price

X54603.16 GHz 120W12MB

E54503.00 GHz 80W12MB
2.83 GHz 80W 12MB
E54302.66 GHz 80W12MB
2.50 GHz 80W12MB
E54102.33 GHz 80W 12MB
2.00 GHz

Pricing for Penryn-based Intel Xeon processors begin at $209 for the entry-level E5405 to $1,172 for the top-end X5460. Although Intel set the launch dates for quad-core Xeon based Penryn processors, the company remains silent on the launch date of the desktop and mobile counterparts.

Intel’s Penryn architecture is the next evolution of the Core 2 micro architecture that made its debut with Woodcrest and Conroe processors. Penryn introduces a 45nm fabrication process with a few additional performance enhancements. Most notably, Penryn introduces new SSE4 instructions for enhanced multimedia performance.

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By crystal clear on 8/18/2007 3:11:29 AM , Rating: 2
This- for those interested in knowing what to expect down the road.

Everyone in the chip industry knows that the giddy, exponential curve they've been riding for decades can't go on forever. Some day a “showstopper” will finally appear, signaling an end to the amazing pace at which microprocessors, memory, and other chips have become denser and faster without getting more expensive. Nobody ever expects that dreaded day to be right around the corner.

But now, sobering revelations about a futuristic, multibillion-dollar chip-making initiative have thrown a shiver through the industry, raising concerns that the showstopper may be closer than anyone had thought.

As recently as March, researchers were still confident that a technique called extreme ultraviolet (EUV) photolithography would be ready in 2011 to start churning out cutting-edge logic chips. But at an advanced lithography symposium held that month by the photonics society SPIE, experts from IBM and its development partners AMD, Micron Technology, and Qimonda said they do not expect EUV to be ready for its intended debut. Others in the industry, though less blunt, say progress made in the coming year will make or break the deadline.

Historically, each generation of photolithography technology has remained useful for about six or seven years, spanning three size reductions, or nodes, in chip processing. Today's technology uses light with a wavelength of 193 nanometers to produce chips with key parts, or features, that measure just 65 nm. If the seven-year rule holds true, 193-nm lithography will need a replacement by 2012 or 2013.

Before anyone panics, it's important to note that the industry has been consistently wrong about when any particular production technology will hit its limits. But with six years to go, it's clearly crunch time for this technology. “The next year or so is going to be crucial,” says Michael C. Mayberry, vice president of Intel's technology and manufacturing group.

“We do believe we have a moral responsibility to keep porn off the iPhone.” -- Steve Jobs
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