OCZ Displays Carbon Nanotube Cooler
June 9, 2007 3:26 AM
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The OCZ Hydrajet cooler, featured upside-down to reaveal the carbon nanotube conductor. (Source DailyTech, Anh Huynh)
The OCZ Hydrojet cooler uses an advanced heatsink material
The first heatsink to make use of directional carbon nanotubes, the OCZ Hydrojet, was on display at Computex 2007. Carbon nanotubes, an allotrope of carbon, are widely regarded as the next major thermal interface material because of their superior thermal conduction properties.
The contact base of the OCZ Hydrojet is made completely of carbon-nanotubes, which OCZ claims are five times more efficient than copper. Carbon nanotubes have been looked upon as a strong alternative to traditional copper based heatsinks. They are ideal for application in heat transfer products because of their impressive heat-conduction properties. Carbon nanotube based interfaces have been shown to conduct more heat than conventional thermal interface materials at the same temperatures. In addition, they have shown to be ballistic conductors at room temperature, which means electrons can flow through CNTs without collisions.
Carbon nanotubes are small wire-like structures made out of a sheet of graphene. The sheet of graphene used to construct CNTs is roughly one-atom thick, and is rolled up into a cylinder. The diameter of the cylinder ranges in the nanometers.
Unlike most other thermal materials, carbon nanotubes are able to move heat in one direction. On the other hand, copper, which is looked upon as one of the more superior thermal materials, moves heat radially. In the case of CNTs, heat is moved along the alignment of the nanotubes.
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RE: In my understanding
6/10/2007 8:57:35 AM
For the first questions, that is simple, it is because the heat transferred from core - heatspreader - heatsink bottom - fins is not a perfect one thermally. That's all there is too it. However, we know that air cooling is not at its best, you just have to look at a water cooling system to know you can do better. A wc system will get better and lower temps then an air cooling system will, yet their is no change in core, heatspreader, or the likes.
as stated above, due to processor design, the Core 2 Duo actually produces less heat while having more transistors to its predecessors.
and for the next question, You are perfectly right in saying that one would not preclude the other from working, however, you really would not need that great of cooling with a CNT processor as they would withstand much higher temps without causing instability (they don't have problems with electron leakage or burnout that occurs on modern cpus when they overheat) the reason it is not used is because the manufacturing process is not there. I don't know how it is now, but just a couple of years ago CNT where some of the most expensive substance on earth, manipulating them is a fair amount different from the ability to manipulate silicon, that is why they are not used (yet) for microprocessor, but trust me, they would be far Superior to current silicon.
"Intel is investing heavily (think gazillions of dollars and bazillions of engineering man hours) in resources to create an Intel host controllers spec in order to speed time to market of the USB 3.0 technology." -- Intel blogger Nick Knupffer
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