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The OCZ Hydrajet cooler, featured upside-down to reaveal the carbon nanotube conductor. (Source DailyTech, Anh Huynh)
The OCZ Hydrojet cooler uses an advanced heatsink material

The first heatsink to make use of directional carbon nanotubes, the OCZ Hydrojet, was on display at Computex 2007. Carbon nanotubes, an allotrope of carbon, are widely regarded as the next major thermal interface material because of their superior thermal conduction properties.  

The contact base of the OCZ Hydrojet is made completely of carbon-nanotubes, which OCZ claims are five times more efficient than copper. Carbon nanotubes have been looked upon as a strong alternative to traditional copper based heatsinks. They are ideal for application in heat transfer products because of their impressive heat-conduction properties.  Carbon nanotube based interfaces have been shown to conduct more heat than conventional thermal interface materials at the same temperatures. In addition, they have shown to be ballistic conductors at room temperature, which means electrons can flow through CNTs without collisions.

Carbon nanotubes are small wire-like structures made out of a sheet of graphene.  The sheet of graphene used to construct CNTs is roughly one-atom thick, and is rolled up into a cylinder. The diameter of the cylinder ranges in the nanometers.

Unlike most other thermal materials, carbon nanotubes are able to move heat in one direction. On the other hand, copper, which is looked upon as one of the more superior thermal materials, moves heat radially. In the case of CNTs, heat is moved along the alignment of the nanotubes.


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RE: In my understanding
By jtok202 on 6/10/2007 12:53:14 AM , Rating: 2
Check out a couple of articles on the design and energy usage for C.P.U's I feel that will give you a better understanding of the need for cooling within a die. Interestingly in millions of transistors there are significantly more transisters in a C2D versus a 939/AM2 however the actual Thermal output is decreased and energy usage is down this goes hand in hand with more efficient transistors even after a increase of density per mm. The idea of a more efficient cover for the CPU is intriguing and there I see a real application for the carbon nanotubes. (if heat transfer is one way they will kill the idea of peltiers :( ) Lapping is not only to remove the nickel which is a relatively poor heat conductor but also to smooth out the insane bows that are present in most CPUS AMD's and INTELS. (read anandtech for a good article on C2D imo and check out xtremesystems.org if you want to see a community for all things overclock/watercooling/lapping so on imo)


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