Intel Goes Lead-Free for 45nm, Again
Nirav Sanghani & Kristopher Kubicki
May 23, 2007 4:34 AM
comment(s) - last by
Lead-tin interconnects, like the ones seen on this Intel "Prescott" processor, are a thing of the past. (Thumbnail and image source: Chipworks)
Intel is taking the next step in environmentally friendly products
announced on Tuesday
that the future of its microprocessors will be lead-free and environmentally friendly. This follows a big tech industry shift towards products that are more environmentally friendly. The shift will begin with its line of "green" 45-nanometer high-k metal gate (Hi-k) processors, which includes the next-generation Intel Core 2 Duo, Core 2 Quad and Xeon processors.
Lead is mainly used in a variety of micro-electric "packages" and "bumps" that attach the Intel chip to "packages", which are then wrapped around the chip and used to connect it to the motherboard. Package designs include pin grid array, ball grid array, and land grid array, and will all be 100 percent lead-free.
With the introduction of 65nm
, Chipworks -- a company that reverses engineers chip packaging -- discovered that Intel
from lead-tin solder-ball interconnects to plated copper pillars. Since then, all 65nm Intel processors no longer use lead for interconnects.
"Intel is taking an aggressive stance toward environmental sustainability, from the elimination of lead and a focus on greater energy efficiency of our products to fewer air emissions and more water and materials recycling," said Nasser Grayeli, Intel vice president and director of assembly test technology development, Technology and Manufacturing Group.
Lead, which can cause neurological damage in humans if ingested, was used in electronics for decades due to its electrical and mechanical properties. Intel produced its first lead-free flash memory product in 2002, and began shipping products with 95 percent less lead than previous chips in 2004. The remaining 5 percent was replaced by a tin/silver/copper alloy in the first-level interconnect, the solder joint that connects the silicon die to the package substrate.
In February 2003, the European Union adopted the Restriction of Hazardous Substances Directive. The directive mandated that all electronics sold must be near lead-free by June 2006. Special clauses protected microprocessors from utilizing some lead in their design, but AMD and Intel both opted to go lead free before the call to action date anyway.
Production on the Intel lead-free 45 nanometer high-k processors,
, will begin in the second half of this year.
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RE: California in my mind .......
5/23/2007 2:45:42 PM
LOL, I think you are too worried about the EU RoHS police. :o) Hardly such a serious concern, especially for low-volume and hobbyist kind of stuff. RoHS is mainly a worry for high volume and/or consumer electronics. Certification isn't even required for low-volume industrial equipment.
RE: California in my mind .......
5/23/2007 7:11:17 PM
Yes, it's not about police as such, it's being able to sell products in Europe, and being RoHS compliant is one of those rules.
But it's also more than that as well, things will need to be RoHS compliant in the U.S. at some point too, writing is on the wall. Parts suppliers have been massively going over to RoHS compliance over the last few years. Some still don't, not 100% of the way there yet, but it'll probably be 100% within a few years (except probably for some legacy products where it'll get dropped before conversion).
"If they're going to pirate somebody, we want it to be us rather than somebody else." -- Microsoft Business Group President Jeff Raikes
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