AMD "Puma" Mobile Platform Details Unveiled
Anh Tuan Huynh
May 17, 2007 5:02 PM
comment(s) - last by
AMD's long-term mobile computing roadmap. (Source: AMD)
AMD prepares to take on Centrino with more power saving features
AMD is preparing to take on Intel’s Centrino, current
, platforms with the next-generation
mobile platform. At the heart of
is AMD’s next-generation
-core 65nm mobile processor, ready to take on
Intel’s Core 2 Duo
with a power saving vengeance.
is a dual-core mobile processor geared towards enhanced performance without sacrificing battery life.
features extensive power saving characteristics, more so than its upcoming
, such as an improved
split power plane
split power plane
allows the memory controller and each processor core to operate with independent voltages.
’s DDR2 memory controller also features an improved DRAM pre-fetcher and enhancements in efficiency. With the split power planes, the memory controller’s power plane operates at a lower voltage than the two CPU cores.
Technical Director Sales and Marketing,
hinted that independent core voltage
would be an upcoming announcement on
earlier this year.
The upcoming AMD
features split power planes for the processor cores and memory controller.
by allowing each processor core to have its own voltage plane, allowing each core to operate with different frequencies and voltages. The system can theoretically disable one core to conserve power with split voltage planes, for minimal idle power consumption.
also supports HyperTransport 3.0 with enhanced power management features. HyperTransport 3.0 allows
to scale the link widths on demand to reduce power consumption.
can also disconnect HyperTransport when it is not needed, even when the processor cores are executing instructions.
to form the
platform. Again, Amato detailed much of this platform earlier this year
as an AMD780-based solution
delivers DirectX 10 graphics with the
Universal Video Decoder, or UVD
, for hardware accelerated Blu-ray and HD DVD high-definition video playback. Multiple display output capabilities are supported with the AMD 780G including DVI, HDMI and
. The chipset also supports HyperTransport 3.0 and PCI Express 2.0.
New to the AMD 780G is AMD’s PowerXPress technology that allows the system to switch between integrated and external
graphics dynamically without restarting Windows. The technology promises “the best of both worlds” by enabling the integrated graphics core when the notebook is running on battery power and automatically switching to the higher performing external graphics while plugged in.
Other notable features of the AMD 780G include support for HyperFlash via upcoming SB700 south bridge. HyperFlash is similar to
Intel’s Turbo Memory technology
and allows notebook manufacturers to attach flash memory to the south bridge for enhanced performance.
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RE: Lets have an interview from D.T. with AMD.
5/20/2007 2:00:06 PM
They just interviewed that Guiseppe guy it looks like (according to the links in the article). I thought he only speaks French, so maybe that's why they didn't break it down into paragraph form like toms hardware.
"Spreading the rumors, it's very easy because the people who write about Apple want that story, and you can claim its credible because you spoke to someone at Apple." -- Investment guru Jim Cramer
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