Print 25 comment(s) - last by theapparition.. on May 17 at 8:55 AM

$130 to be Legendary
Final chapter of Halo trilogy hits September 25

Originally believed to be released in the later parts of fall, Bungie just revealed that its hotly anticipated Halo 3 will see stores just two days into the season. Halo 3 will be released in North America on September 25, with the European release hitting the day after.

The announcement of Halo 3’s official release date comes just hours before the Halo 3 multiplayer public beta hits Xbox Live, currently scheduled for 5 a.m. PDT on May 16.

According to comments made by Bungie executive producer Jonty Barnes, much of Halo 3 is complete – all that remains are the finishing touches. “Essentially at this point in the project all the hard-planned scheduling time is behind us and we’re no longer reevaluating or unblocking dependencies, we’re moving into polish the game,” he said “What this means is when I’m looking at the game now it’s a representative experience and working with the team to make targeted and iterative improvements.”

So what does a hard street date mean for the developers? Barnes says, “Not much for Bungie, that’s been the plan for months and months. The only thing it does however is make the end seem very, very real to people.”

Although the earlier-than-expected ship date for Halo 3 is a mild surprise, word about the release date may have first slipped from Microsoft Games Studios’ Shane Kim, who said in a 1UP interview, “If [Bungie] can get [Halo 3] out before GTA4, they probably feel like that's better, sort of like Xbox 360 coming out before PlayStation 3.”

Microsoft Game Studios and Bungie Studios announced in March that Halo 3 will come in three versions when it is released later this year. The Standard Edition ($59.99) will feature just the game. The Limited Edition ($69.99) will come on a metal collector’s case and will feature a bonus disc and art book. The Legendary Edition ($129.99) will come with a Spartan Helmet, two bonus discs and storyboard art.

Comments     Threshold

This article is over a month old, voting and posting comments is disabled

RE: 65nm 360 please
By IMPoor on 5/16/2007 2:44:16 PM , Rating: -1
You need to check yourself, not me.
1. The red ring indicates a hardware failure. thats not always overheating. It could be something else. My cousins was red ringing out of the box before it had time to heat up. we took it right back, replaced it, and now its fine for over a year.
2. I don't deny the red ring is real as I have seen it in the above example but I think you will find the failure rate of 360s is close to the failure rate of the average consumer electronic product. I am certain overheating can still occur with the 65nm chip. I am certain the current failure rate will only slightly drop with the 65nm chip since overheating is only one reason for failure.

I got my facts straight but wait until you read your first red ring post from a 65nm owner in the fall before you "mouth off".

RE: 65nm 360 please
By vitul on 5/16/2007 3:42:07 PM , Rating: 2
the heat difference between the 65nm and the 90nm isint going to stop any of the problems. people are saying its actually warping the main board due to heat.

look at the dual core pentiums with 90nm and the 65nm the heat difference is VERY minimal.

the damage being done to the 360s with rrod needs a serious cooling change.

RE: 65nm 360 please
By theapparition on 5/17/2007 8:55:41 AM , Rating: 2
Just to clarify, heating a PCB will not cause it to warp. PC boards are composites, made of basically fiberglass and copper. Both of these materials have different coefficients of thermal expansion. My speculation, is that the board is unbalanced with too much copper on some layers, and not enough on others. When this happens, that can cause the board to warp and break solderballs. The chips themselves also have different coefficients, and just plain warping may not be necessary as the solderballs can break from a shearing action.
I'd like to see some long term data on the PCB layout in the elite system.

RE: 65nm 360 please
By dflynchimp on 5/17/2007 1:08:39 AM , Rating: 3
Yet overheating is actually one of the foremost reasons for failure. You can't penalize people for wanting to bid on the extra reliability. At least in computer chips and motherboards overheating and motherboard warping due to heat are both widely documented and frequent cases of error and failure. The 360 is essentially a compact computer packed into a very small space, so cooling becomes a major issue. If 65nm does significantly decrease both heat output as well as power consumption then I don't see why you have to flame it. Seriously, for those of us paying the power bill every penny counts.

"You can bet that Sony built a long-term business plan about being successful in Japan and that business plan is crumbling." -- Peter Moore, 24 hours before his Microsoft resignation
Related Articles

Copyright 2016 DailyTech LLC. - RSS Feed | Advertise | About Us | Ethics | FAQ | Terms, Conditions & Privacy Information | Kristopher Kubicki