Intel Details "Skulltrail" Enthusiasts Platform
Anh Tuan Huynh
April 17, 2007 12:50 AM
comment(s) - last by
Intel prepares to take on AMD's Quad FX
Intel hinted at the possibilities of a high-end gaming system based around its
Xeon workstation processors
earlier this year at CES 2007. The
featured two Xeon
processors clocked at 2.4 GHz and a single
GeForce 8800 GTX
graphics card. Although it was a proof of concept to counter
AMD’s Quad FX
enthusiast platform at the time, Intel has announced the
concept will become a reality at its
Spring Intel Developer Forum
in Beijing, China.
Intel has named its new enthusiast platform
. Intel has remained very tight-lipped about its
platform except a few basic features.
will arrive later this year and accommodate two
Core micro architecture
. It is unknown if Intel will develop a new platform to accommodate dual LGA775 socket processors or rework its
LGA771 socket Xeon
workstation platform to accommodate unbuffered DDR2 memory. Intel’s Xeon workstation platform only accepts FB-DIMM memory.
On the graphics processing side of things,
will sport four PCIe slots for graphics expansion. Intel doesn’t divulge details on which multi-GPU graphics technology
takes advantage of, however, Intel’s current 975X Express supports AMD’s CrossFire technology.
Intel has not released any details on the chipset powering
yet. Nevertheless, Intel expects to unveil its next-generation single processor enthusiast chipset,
, later this year.
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RE: 2 Chips, 4 Dies, 8 Cores?
4/17/2007 10:06:21 AM
There's no performance difference and it's cheaper for multi-chip packages.
RE: 2 Chips, 4 Dies, 8 Cores?
4/17/2007 7:52:19 PM
Although I would tend to agree with that sentiment in general, I did not see any conclusions about performance differences in that link. It said it was more efficient from a development standpoint, as you don't have to redesign the whole chip, just the die in question. This does allow for cheaper, faster development of new chips, as some dies may be upgraded and others completely unchanged.
However, with regards to performance, that very much depends on the specific implementation of the multi-die chip (or multi-chip module). With multiple dies, your inter-die communication has to be well thought out. Some chips may do it just as well as a single-die chip, and there would be equal performance. However, if the two dies had to communicate over the FSB, this could provide a performance disadvantage. In the future I'm pretty sure all MCM packages will have a better approach and there will not be a difference in performance. But that doesn't mean there is never a difference, because it really depends how they do things.
"If you look at the last five years, if you look at what major innovations have occurred in computing technology, every single one of them came from AMD. Not a single innovation came from Intel." -- AMD CEO Hector Ruiz in 2007
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