Panasonic, et al. Consolidate 3G/4G Chips Into Single Chip for Intl. Phones
February 25, 2012 2:40 PM
comment(s) - last by
New chip can handle common 3G and 4G communications standards of Japan, China, and U.S.
The wireless communications hardware market is rapidly changing. Later this year Qualcomm, Inc. (
) will ship product
with on-die LTE modems
. And Intel Corp. (
) recently unveiled
an experimental version of its Atom CPU
, which succeeded in the even more daunting task of packing analog components for an on-die Wi-Fi modem.
However, if you want a true
3G/4G "international" phone
, optimized for all the different frequencies of different regional networks, you still need two more extra chip, in addition to your core system-on-a-chip (SoC). For a small phone like the iPhone those extra chips can be a dealbreaker.
But a coalition of top Japanese chipmakers -- NTT DoCoMo, Inc. (
), NEC Corporation (
), Panasonic Corp. (
) subsidiary Panasonic Mobile Communications Comp., Ltd., and Fujitsu Ltd. (
) -- have come together to consolidate all those chips into a single chip [
The new multi-modem combines circuitry from multiple chips into a single die
for international phones. [Image Source: NTT DoCoMo]
The new chip combines hardware and digital processing software to make a single single large-scale integration (LSI) package. It will likely be first seen in individual packaged chips, but could eventually be incorporated into licensees' SoC designs, as well.
The chip contains support for major alternative standards. For example, where the U.S. use frequency dependent duplexing long-term evolution (4G LTE), the chip also support's China's slightly different time dependent duplexing LTE (4G TD-LTE).
The chip also packs HSPA+ (a common advanced 3G technology on networks in the U.S. and abroad), W-CDMA (a 3G technology in Japan), and GSM (the world's most used 3G standard).
The chip isn't perfect. Noticably absent is support for WiMAX (an alternative 4G standard),
TD-CDMA (China, 3G)
, and CDMA2000 (U.S., 3G) -- among others. Still the new chip goes a long way towards consolidating the slew of chips in your average international phone, and guarantees that in most of the world's top makets (U.S., China, Japan, EU, etc.) that you'll have at least one or two compatible networks.
Looking ahead, while daunting interference and size challenges remain, it is very feasible that within the next five years expect the industry's top innovators to combine their analog and digital radio-processing equipment into a single on-die piece of silicon capable of handling virtually every Wi-Fi, 3G, 4G, and beyond wireless communications standard. Such a super-chip will revolutionize the industry -- and global communications -- when it arrives. Until then, chips like this new multi-standards modem represent important baby steps towards that goal.
NTT DoCoMo, et al.
This article is over a month old, voting and posting comments is disabled
2/25/2012 11:40:02 PM
at least they stated hspa+ as 3g not fake 4g
this is an GSM all in one chip so unlikely to see CDMA integrated (not as GSM/CDMA chip) for an bit and wimax why bother no one supports it any more, LTE all the way as its supported by all networks that use it that is
RE: 3g 4g
2/26/2012 5:15:09 PM
Doesn't matter what they call it, my hspa+ is getting faster speed on its network then I am getting with "real" 4g network. Same with my "fake" athlon ghz is faster then intel's in the early 2000s, lol.
"Can anyone tell me what MobileMe is supposed to do?... So why the f*** doesn't it do that?" -- Steve Jobs
One Chip to Rule Them All: Intel Bakes Wi-Fi On-Die on "Rose Point" SOC
February 20, 2012, 11:42 AM
Qualcomm Unleashes Dual and Quad-core 2.5GHz Mobile ARM SoCs
February 14, 2011, 10:01 AM
Verizon Leak: 1.3 GHz Droid Pro, Android 3.0 Tablet, and LTE All Incoming
August 9, 2010, 2:05 PM
Motorola Scores Massive $310M USD China Cell Phone Contract
May 15, 2009, 9:06 AM
Report: Microsoft Lumia 830 Headed to AT&T on November 7
September 30, 2014, 12:51 PM
Update: Samsung Responds to Reports of Screen Gaps on Galaxy Note 4
September 30, 2014, 11:02 AM
Apple to Begin iPhone 6, iPhone 6 Plus Sales in China October 17
September 30, 2014, 9:55 AM
eBay to Spin Off PayPal Business Next Year
September 30, 2014, 7:28 AM
HP Adds $99 Windows Tablet, $199 Windows Notebook to Stream Family
September 29, 2014, 7:17 PM
Following Quirky Passport, BlackBerry Aims to Release One Unconventional Device Per Year
September 29, 2014, 6:45 PM
Most Popular Articles
Appalling Negligence: Decade-Old Windows XPe Holes Led to Home Depot Hack
September 8, 2014, 8:58 PM
iBend: Reports Grow of Razor-Thin iPhone 6+ Folding Like Origami in Your Pocket
September 23, 2014, 6:08 PM
New AT&T Mobile Share Value "Double Data" Promotion Lasts Through October
September 28, 2014, 8:32 AM
Update: Apple Releases iOS 8.0.2 Update to Make Up for Botched 8.0.1 Release
September 25, 2014, 8:19 PM
TiVo Mega Features 24TB of Storage, Can Record Three Years* Worth of TV Content
September 8, 2014, 8:45 AM
Latest Blog Posts
The Surface Mini That Was Never Released Gets "Hands On" Treatment
Sep 26, 2014, 8:22 AM
ISIS Imposes Ban on Teaching Evolution in Iraq
Sep 17, 2014, 5:22 PM
Space Terrorism is a Looming Threat For the United States
Apr 23, 2014, 7:47 PM
Facebook Aims to Provide Internet to "Every Person in the World" with Drones, Satellites
Apr 1, 2014, 10:20 AM
Retail Mobile Sites Experience Outages in Light of Simplexity's Bankruptcy
Mar 14, 2014, 8:48 AM
More Blog Posts
Copyright 2014 DailyTech LLC. -
Terms, Conditions & Privacy Information