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Samsung 30nm class wafer and memory module  (Source: Samsung)
New modules are aimed at green IT

Samsung announced today that it has begun the mass production of a new 30nm-class 32GB memory module for green IT systems. This is the first time in the industry that mass production using 32GB modules and 30nm class chips has started. The 30nm modules use 4Gb DDR3 DRAM chips.

“With this module, Samsung has secured the highest level of product and solution competitiveness in the DRAM market for PC, server and mobile applications,” said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics.

“We also plan to ship more energy-efficient 4Gb DDR3 DRAM based on 20nm-class* process technology in the second half of this year, which will significantly expand the rapidly growing market for green IT memory solutions. Moreover, we intend to keep delivering the greenest memory products with optimal performance for customers,” he added.
The new modules that Samsung is producing include 32GB RDIMM and 8GB SO-DIMM modules. 

The RDIMM modules operate on 1.35V and can perform at up to 1866Mbps, which is 40% better than the 1333Mbps 40nm class modules operating at 1.5V. The new modules also consume 18% less power. The 8 GB SO-DIMM modules operate at up to 2133Mbps at 1.5V.

Samsung expects that almost 10% of its total DRAM shipments in 2012 will be 4Gb modules.





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