Samsung Announces 3D Chip Packaging Technology
April 13, 2006 9:34 AM
comment(s) - last by
Samsung Semiconductor becomes the first company to announced 3D memory packaging
Samsung just announced a new method to pack more memory into small spaces -- three-dimensional chip packaging. The technique works by adding "through silicon" interconnects on the memory module and then daisy chaining multiple modules through the interconnects. Samsung has dubbed this new technology "wafer-level stack process" or WSP.
Existing semiconductor packaging relies on wire bonding to a printed circuit board (PCB). The wire bonding requires space between the interconnects to eliminate interference, but ultimately becomes the limiting factor when attempting to create high density memory. "Through silicon" interconnects are essentially laser cut holes between the memory dice. The holes are later filled-in with a conductive material creating a vertical interconnect.
Samsung researchers managed to stack eight 2Gb NAND chips onto one package. The result is a 16Gb NAND chip that is just over half a milimeter in height. The same technology will also be used for DRAM later this year and multimedia controllers. Cell phone, PDA and high density server components are all the likely candidates for this new process. Samsung's newest NAND hard drive,
announced a few weeks ago
, would only be eight millimeters high if the WSP package allowed for all 256 modules to stack on the same packaging.
However, 3D packaging isn't the best route for chip assembly. On relatively slow NAND modules, the thermal envelope is not a huge factor. High speed DRAM, on the other hand, has much higher operating temperatures and will not likely adopt Samsung's WSP or other 3D packaging in the near future.
This article is over a month old, voting and posting comments is disabled
4/16/2006 10:47:12 AM
LOL well if people are going to be daft about this
and not discuss the artical
"DICE - The Amiga/embedded/generic 68000 C compiler"
so it seems while this is a 'good thing!" its not
going to help make more compact faster CPU's, GPU's or
PPU's any time soon ?.
"I want people to see my movies in the best formats possible. For [Paramount] to deny people who have Blu-ray sucks!" -- Movie Director Michael Bay
Samsung Launches NAND Flash-Based 32GB Solid-State Disk
March 22, 2006, 10:26 AM
Laptop or Tablet - Which Do You Prefer?
September 20, 2016, 6:32 AM
Microsoft Surface Pro 3 - Battery Issue Fixed
August 30, 2016, 6:30 AM
First Apple Computer Auctions for $815,000
August 27, 2016, 7:51 AM
Lenovo vs. Asus vs. HP - Best Laptop Under $500.00
August 19, 2016, 4:00 AM
Best Router for Your Home Network (Under $200.00)
August 6, 2016, 9:51 PM
5 Top Rated Printers for Home or Small Office
July 29, 2016, 10:44 PM
Most Popular Articles
Are you ready for this ? HyperDrive Aircraft
September 24, 2016, 9:29 AM
Leaked – Samsung S8 is a Dream and a Dream 2
September 25, 2016, 8:00 AM
Yahoo Hacked - Change Your Passwords and Security Info ASAP!
September 23, 2016, 5:45 AM
A is for Apples
September 23, 2016, 5:32 AM
Walmart may get "Robot Shopping Carts?"
September 17, 2016, 6:01 AM
Latest Blog Posts
Burlington Gun Attack
Sep 27, 2016, 5:00 AM
Who is in Risk of Getting Oral Cancer?
Sep 23, 2016, 6:02 AM
France Bans Plastic Eating Utensils in Restaurants
Sep 18, 2016, 10:49 AM
Progress Against Acute Myeloid Leukemia
Sep 17, 2016, 5:30 AM
Apple Watch Series 2 - Number 1 in the Customer Satisfaction.
Sep 7, 2016, 6:19 PM
More Blog Posts
Copyright 2016 DailyTech LLC. -
Terms, Conditions & Privacy Information