Samsung Announces 3D Chip Packaging Technology
April 13, 2006 9:34 AM
comment(s) - last by
Samsung Semiconductor becomes the first company to announced 3D memory packaging
Samsung just announced a new method to pack more memory into small spaces -- three-dimensional chip packaging. The technique works by adding "through silicon" interconnects on the memory module and then daisy chaining multiple modules through the interconnects. Samsung has dubbed this new technology "wafer-level stack process" or WSP.
Existing semiconductor packaging relies on wire bonding to a printed circuit board (PCB). The wire bonding requires space between the interconnects to eliminate interference, but ultimately becomes the limiting factor when attempting to create high density memory. "Through silicon" interconnects are essentially laser cut holes between the memory dice. The holes are later filled-in with a conductive material creating a vertical interconnect.
Samsung researchers managed to stack eight 2Gb NAND chips onto one package. The result is a 16Gb NAND chip that is just over half a milimeter in height. The same technology will also be used for DRAM later this year and multimedia controllers. Cell phone, PDA and high density server components are all the likely candidates for this new process. Samsung's newest NAND hard drive,
announced a few weeks ago
, would only be eight millimeters high if the WSP package allowed for all 256 modules to stack on the same packaging.
However, 3D packaging isn't the best route for chip assembly. On relatively slow NAND modules, the thermal envelope is not a huge factor. High speed DRAM, on the other hand, has much higher operating temperatures and will not likely adopt Samsung's WSP or other 3D packaging in the near future.
This article is over a month old, voting and posting comments is disabled
4/14/2006 3:16:18 PM
Guys, go check your dictionary. Either 'dies' or 'dice' are the plural form for 'die'.
So now that we can get over the syntax issue can we start having a thoughtful conversation about these development?
4/14/2006 3:17:23 PM
(We need an edit option)
"Spreading the rumors, it's very easy because the people who write about Apple want that story, and you can claim its credible because you spoke to someone at Apple." -- Investment guru Jim Cramer
Samsung Launches NAND Flash-Based 32GB Solid-State Disk
March 22, 2006, 10:26 AM
4/16/2014 Hardware Reviews
April 16, 2014, 9:01 AM
Quick Note: Kingston's 1 TB USB Stick Hits $899 on Lightning Deal
April 15, 2014, 3:35 PM
4/15/2014 Hardware Reviews
April 15, 2014, 11:30 AM
4/11/2014 Hardware Reviews
April 11, 2014, 11:03 AM
Global PC Shipments Declined 1.7 Percent in Q1 2014
April 10, 2014, 9:58 AM
Intel Previews Devil's Canyon Chip, "Black Book", and Broadwell
March 21, 2014, 8:15 AM
Most Popular Articles
Cities to Carpoolers: Sharing Your Car is Illegal, We Will Seize Your Cars
April 4, 2014, 9:17 PM
iPad Exploiter is Freed by Federal Appeals Court
April 11, 2014, 7:40 PM
A-10 Warthog May Live to Fight Another Day with Support from Lawmakers
April 14, 2014, 9:41 AM
Taiwan's AOU Claims to Have World's Highest-Res. OLED Smartphone Display
April 11, 2014, 1:44 PM
EFF: NSA May Have Used IRC Botnets to Exploit Heartbleed for Last Two Years
April 14, 2014, 4:43 PM
Latest Blog Posts
Facebook Aims to Provide Internet to "Every Person in the World" with Drones, Satellites
Apr 1, 2014, 10:20 AM
Retail Mobile Sites Experience Outages in Light of Simplexity's Bankruptcy
Mar 14, 2014, 8:48 AM
Tesla vs. BMW: Who Has the Safer EV?
Feb 1, 2014, 2:56 PM
Justice Leaks Details of Next HTC One Two Flagship Phone
Dec 5, 2013, 4:04 PM
Global Cyber Espionage Concerns Reveal Growing Cyber Armies
Nov 29, 2013, 11:04 AM
More Blog Posts
Copyright 2014 DailyTech LLC. -
Terms, Conditions & Privacy Information