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Samsung Semiconductor becomes the first company to announced 3D memory packaging

Samsung just announced a new method to pack more memory into small spaces -- three-dimensional chip packaging.  The technique works by adding "through silicon" interconnects on the memory module and then daisy chaining multiple modules through the interconnects.  Samsung has dubbed this new technology "wafer-level stack process" or WSP.

Existing semiconductor packaging relies on wire bonding to a printed circuit board (PCB).  The wire bonding requires space between the interconnects to eliminate interference, but ultimately becomes the limiting factor when attempting to create high density memory. "Through silicon" interconnects are essentially laser cut holes between the memory dice.  The holes are later filled-in with a conductive material creating a vertical interconnect.

Samsung researchers managed to stack eight 2Gb NAND chips onto one package.  The result is a 16Gb NAND chip that is just over half a milimeter in height.  The same technology will also be used for DRAM later this year and multimedia controllers.  Cell phone, PDA and high density server components are all the likely candidates for this new process.  Samsung's newest NAND hard drive, announced a few weeks ago, would only be eight millimeters high if the WSP package allowed for all 256 modules to stack on the same packaging. 

However, 3D packaging isn't the best route for chip assembly.  On relatively slow NAND modules, the thermal envelope is not a huge factor.  High speed DRAM, on the other hand, has much higher operating temperatures and will not likely adopt Samsung's WSP or other 3D packaging in the near future.


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RE: WSP
By elT on 4/13/2006 11:54:43 AM , Rating: 2
Stop moaning already. People who actually work make mistakes in the process. You should be all b***slaped, Rick James style, for this constant moaning. It's a simply typo....what's the fuss?!


RE: WSP
By Exodus220 on 4/13/06, Rating: -1
RE: WSP
By Exodus220 on 4/13/2006 12:19:14 PM , Rating: 2
They are just lucky this is submitted online because they have the ability to edit after submission. If this were printed material then they would not have a way to correct their errors and that would demonstrate to me that they do not proof read their material before submitting it.


RE: WSP
By elT on 4/13/2006 5:00:31 PM , Rating: 2
To constantly critcize others for minor mistakes that have no real impact on the substance is to escape own inperfections and ignore working on them. Finding the resort in others mistakes from your own is a big no no, no matter by what exponent your manhood might grow.

If you were really that bothered by it, why not write a nice, advice full e-mail to the editors and point out. But no, it won't be in public where your ever endagered manhood, by your own insecurities, can be saved.

Peace


RE: WSP
By Spinne on 4/13/2006 6:04:35 PM , Rating: 2
I think they report it publicly because writing personal email to the editor because of a spelling typo is too big a hassle. I doubt if they have ill-intentions towards DT or they probabl y wouldn't be here.


RE: WSP
By elT on 4/13/2006 6:18:19 PM , Rating: 2
I never said they had ill intentions. But the fuss about nothing even remotly important doesn't sound to healthy to me either.


RE: WSP
By elT on 4/13/2006 6:20:13 PM , Rating: 2
I suppose I should be banned for my splezling miztakefs.
:rolleye:


RE: WSP
By Knish on 4/13/2006 8:01:13 PM , Rating: 2
"They are just lucky this is submitted online because they have the ability to edit after submission. If this were printed material then they would not have a way to correct their errors and that would demonstrate to me that they do not proof read their material before submitting it. "

If this were printed material you wouldn't have heard about it yet.


RE: WSP
By oTAL on 4/14/2006 1:42:53 PM , Rating: 2
"dice" is one possible plural for die.


"Death Is Very Likely The Single Best Invention Of Life" -- Steve Jobs

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