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Samsung Semiconductor becomes the first company to announced 3D memory packaging

Samsung just announced a new method to pack more memory into small spaces -- three-dimensional chip packaging.  The technique works by adding "through silicon" interconnects on the memory module and then daisy chaining multiple modules through the interconnects.  Samsung has dubbed this new technology "wafer-level stack process" or WSP.

Existing semiconductor packaging relies on wire bonding to a printed circuit board (PCB).  The wire bonding requires space between the interconnects to eliminate interference, but ultimately becomes the limiting factor when attempting to create high density memory. "Through silicon" interconnects are essentially laser cut holes between the memory dice.  The holes are later filled-in with a conductive material creating a vertical interconnect.

Samsung researchers managed to stack eight 2Gb NAND chips onto one package.  The result is a 16Gb NAND chip that is just over half a milimeter in height.  The same technology will also be used for DRAM later this year and multimedia controllers.  Cell phone, PDA and high density server components are all the likely candidates for this new process.  Samsung's newest NAND hard drive, announced a few weeks ago, would only be eight millimeters high if the WSP package allowed for all 256 modules to stack on the same packaging. 

However, 3D packaging isn't the best route for chip assembly.  On relatively slow NAND modules, the thermal envelope is not a huge factor.  High speed DRAM, on the other hand, has much higher operating temperatures and will not likely adopt Samsung's WSP or other 3D packaging in the near future.


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WSP
By kalaap on 4/13/2006 10:34:21 AM , Rating: 1
"wafter-level stack process"

Whats a wafter?




RE: WSP
By Lonyo on 4/13/2006 10:56:14 AM , Rating: 1
And what's a memory dice?


RE: WSP
By ShadowD on 4/13/06, Rating: -1
RE: WSP
By elT on 4/13/2006 11:54:43 AM , Rating: 2
Stop moaning already. People who actually work make mistakes in the process. You should be all b***slaped, Rick James style, for this constant moaning. It's a simply typo....what's the fuss?!


RE: WSP
By Exodus220 on 4/13/06, Rating: -1
RE: WSP
By Exodus220 on 4/13/2006 12:19:14 PM , Rating: 2
They are just lucky this is submitted online because they have the ability to edit after submission. If this were printed material then they would not have a way to correct their errors and that would demonstrate to me that they do not proof read their material before submitting it.


RE: WSP
By elT on 4/13/2006 5:00:31 PM , Rating: 2
To constantly critcize others for minor mistakes that have no real impact on the substance is to escape own inperfections and ignore working on them. Finding the resort in others mistakes from your own is a big no no, no matter by what exponent your manhood might grow.

If you were really that bothered by it, why not write a nice, advice full e-mail to the editors and point out. But no, it won't be in public where your ever endagered manhood, by your own insecurities, can be saved.

Peace


RE: WSP
By Spinne on 4/13/2006 6:04:35 PM , Rating: 2
I think they report it publicly because writing personal email to the editor because of a spelling typo is too big a hassle. I doubt if they have ill-intentions towards DT or they probabl y wouldn't be here.


RE: WSP
By elT on 4/13/2006 6:18:19 PM , Rating: 2
I never said they had ill intentions. But the fuss about nothing even remotly important doesn't sound to healthy to me either.


RE: WSP
By elT on 4/13/2006 6:20:13 PM , Rating: 2
I suppose I should be banned for my splezling miztakefs.
:rolleye:


RE: WSP
By Knish on 4/13/2006 8:01:13 PM , Rating: 2
"They are just lucky this is submitted online because they have the ability to edit after submission. If this were printed material then they would not have a way to correct their errors and that would demonstrate to me that they do not proof read their material before submitting it. "

If this were printed material you wouldn't have heard about it yet.


RE: WSP
By oTAL on 4/14/2006 1:42:53 PM , Rating: 2
"dice" is one possible plural for die.


RE: WSP
By Eskimo on 4/13/2006 12:10:04 PM , Rating: 2
Dice is plural for die, a common term used in the industry to refer to a single chip on a wafer.


RE: WSP
By PrinceGaz on 4/14/2006 5:04:35 AM , Rating: 2
Wrong. Dice is plural for die, but only ever means a cube (or other polyhedron) used in gaming. Dies is also plural for die and is the correct word to use when referring to multiple chips on a wafer.


RE: WSP
By Griswold on 4/15/2006 2:50:14 PM , Rating: 2
You are both wrong and right.

Dice is a polyhedron used in gaming. But Dice is also the term used by people in industry to describe the plural of Die.



RE: WSP
By david99 on 4/16/2006 10:47:12 AM , Rating: 2
LOL well if people are going to be daft about this
and not discuss the artical
"DICE - The Amiga/embedded/generic 68000 C compiler"
http://www.obviously.com/dice/

so it seems while this is a 'good thing!" its not
going to help make more compact faster CPU's, GPU's or
PPU's any time soon ?.


RE: WSP
By The Boston Dangler on 4/13/2006 7:29:19 PM , Rating: 2
If you had one memory die, and I gave you another memory die, you would have, take a guess, cmon, yes, two memory dice.


RE: WSP
By PrinceGaz on 4/14/2006 5:09:45 AM , Rating: 2
No you would not have two memory dice, you would have two memory dies.

Unless you painted a number on each side of the two memory dies and rolled them in games of chance, in which case I suppose you would have two "memory" dice: dice that are made from memory chips :)


RE: WSP
By InternetGeek on 4/14/2006 3:16:18 PM , Rating: 2
Guys, go check your dictionary. Either 'dies' or 'dice' are the plural form for 'die'.

So now that we can get over the syntax issue can we start having a thoughtful conversation about these development?


RE: WSP
By InternetGeek on 4/14/2006 3:17:23 PM , Rating: 2
*this

(We need an edit option)


RE: WSP
By david99 on 4/16/2006 11:02:30 AM , Rating: 2
"By The Boston Dangler on 4/13/2006 7:29:19 PM , Rating: 2

If you had one memory die, and I gave you another memory die, you would have, take a guess, cmon, yes, two memory dice"

well if the other 3 guys all put in one due each
and i put in a 'B' and my die to the pot then would that
mean that this artical would " 'B' 2 die 4 " LOL :)

its about time people started having some fun around here


RE: WSP
By david99 on 4/16/2006 11:03:47 AM , Rating: 2
due=die
that edit option would be so nice about now


RE: WSP
By Googer on 4/13/2006 3:55:14 PM , Rating: 2
This would be cool if AMD did this with Athlon X2 CPU's. We would get four cores and quad-channel memory controllers, that would traslate in to not having to deal with 2T memory timings and more bandwith.


RE: WSP
By PrinceGaz on 4/14/2006 5:11:32 AM , Rating: 2
You might want to read the last paragraph of the the article where it talks about heat.


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