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Intel President Paul Otellini shows off a 300mm wafer containing Sandy Bridge chips
"Westmere" is only the first step, as "Sandy Bridge" will be where Intel really gets into 32nm.

The product launch of Intel's Westmere 32nm die-shrink may be just around the corner, but they aren't resting on their laurels. Sandy Bridge, Intel's next-generation architecture, is already being produced in test batches at D1D in Hillsboro, Oregon.

D1D is Intel's development fab, and is used to decrease defect densities and increase yields before the line is duplicated in the firm's worldwide manufacturing network. Intel's President Paul Otellini showed off a 300mm Sandy Bridge wafer during his opening keynote at the Intel Developer Forum in San Francisco earlier today.

Intel is currently focusing on ramping up production of Westmere-based Clarkdale and Arrandale CPUs so that there will be sufficient quantities available when they go on sale in the fourth quarter of this year. Fab D1C and AFO (Aloha Factory Operations) will also ramp up Westmere production in Q4.

Many people have questioned why Intel doesn't plan on releasing a quad-core Westmere chip, instead going with a six-core variant named Gulftown and several dual-core designs that will be paired with a 45nm graphics chip.

The answer is twofold. Intel will be capacity constrained on 32nm, with only a few fabs producing mainstream, high volume parts. Secondly, the main thrust of Intel's 32nm production will be in two major fabs which are currently undergoing expansion and retooling.

Intel's "Megafab", Fab 32 in Chandler, Arizona, will start 32nm production in late 2010, followed by Fab 11X in Rio Rancho, New Mexico. Fab 32 has a very large cleanroom at 320,000 square feet, but is eclipsed by Fab 11X's massive 370,000 sq. ft cleanroom.

Sandy Bridge will also feature a sixth generation graphics core on the same die as the processor core. It includes 256-bit AVX instructions for floating point, media, and processor intensive software.


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round vs. square
By ipay on 9/22/2009 7:19:05 PM , Rating: 2
Why are the wafers round, when the processor dies are square ?




RE: round vs. square
By jlips6 on 9/22/2009 7:29:24 PM , Rating: 5
they grow the pure silicon crystals in cylinders. that circle is a section of one of those cylinders.


RE: round vs. square
By ZmaxDP on 9/22/2009 11:58:56 PM , Rating: 2
I know why, but this makes me think of the taco commercial airing in Texas right now where the kid makes a taco shell with a flat bottom so it will stand up on it's own and people treat him like he's a hero...

It's like, someone figure out how to grow a square or rectangular crystal already...


RE: round vs. square
By wsko on 9/23/2009 12:45:04 AM , Rating: 2
Another reason for round wafer is mechanical stability. Round shape is stronger than rectangular shape. Such a big wafer can shatter very easily. Breaking a wafer with > 50 CPUs on it would cost a lot of $$$


RE: round vs. square
By jemix on 9/23/2009 1:12:55 AM , Rating: 3
Wafers are round because they are spun, and need to be balanced. There are other reasons as well.

Here's a couple videos that better explain the manufacturing process.

Intel
http://www.youtube.com/watch?v=duzO0YX4WnA

AMD
http://www.youtube.com/watch?v=-GQmtITMdas
You might get a little confused at the end of this video when they show just one chip is made from the wafer when in fact hundreds of chips are produced.


RE: round vs. square
By Ammohunt on 9/23/2009 2:42:48 PM , Rating: 2
Why are Ritz crackers round and Triscuits not? it just is accept it.


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