IBM, NEC Electronics, and Toshiba announced an extended a technology development agreement. The agreement covers the participation of the companies in the joint development of 28nm, high-k metal gate low-power chip technology. The development of the technology is intended to be used eventually in consumer electronic devices.

The push towards 28nm technology will not only make chips for devices like computers and cell phones that have more performance, but will allow for longer battery life thanks to the chip consuming less power.

"The advanced 28nm low-power process technology will dramatically enhance the product's density, performance, as well as power consumption compared to the former 40nm node, providing highly competitive solutions, especially in the fields of consumer electronics and automotive," said Masao Fukuma, senior vice president of NEC Electronics. "Utilizing this process technology with NEC Electronics' proprietary eDRAM, high-reliability, and low-power consumption technologies, we will focus on being the first to market with the SoC products that can meet our customers' expectations with added value."

The 28nm alliance also worked together on 32nm HKMG technology and the clients can reportedly transfer to the new 28nm technology with needing a major redesign.

Garry Patton, VP of IBM semiconductor research and development center said in a statement, "NEC Electronics and Toshiba bring significant skills and resources that will help ensure development of an industry-leading 28nm technology offering. Together, the alliance partners will deliver a high-performance, energy efficient technology to enable a full range of multifunction, power-sensitive mobile and consumer electronics."