Samsung's advanced DDR3 chips offer higher performance with lower power needs

Samsung announced this week that it is the first DRAM makers to ship advanced 16GB DDR3 memory modules based on the world's first 2Gb, 50nm DDR3 chips. Samsung says that it is now shipping 18 different configurations of its high-density, DDR3 modules designed for servers.

Among the offerings are a 16GB RIMM module and an 8GB RDIMM module. The company introduced 50nm 2Gb DDR3 for PC applications last September. The 16GB modules operate at 1066Mbps and allow for a total memory density of 192GB in a dual socket server.

The modules are also the first 16GB modules to run at 1.35 volts offering a power savings of 20% compared to 1.5V DDR3 solutions on the market. With the lower power requirements for the 16GB modules, Samsung also says that its 2Gb DDR3 itself needs 40% of the power that 1Gb 16GB configurations need.

Even small power savings can add up to significant savings in power and cooling expenses for companies that run large data farms and sever networks. Samsung reports that research firm IDC expects the global DDR3 market to reach 29% of the total DRAM market in 2009.

In late January 2009, Samsung announced an even higher density DRAM chip at 4Gb that needs 1.35 volts to operate and will be used in 16GB RDIMM modules as well as other applications for desktop and notebook computers in the future. The higher density 4Gb chips can run at 1.6Gbps with the same power requirements as the 2Gb version running at 1066Mbps.

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