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Microsoft preps 65nm GPU for cooler Xbox 360s

Chip process evolution is a usual thing in a console’s lifecycle, but rarely has it been as important as in the case of the Xbox 360.

Known for its relatively hardware fragility, the original design of the Xbox 360 would frequently fall to the “Red Ring of Death” failure, which Microsoft terms as the three flashing red lights. While improvements in cooling and a CPU die shrink to 65nm in the Falcon revision have surely improved the situation, the problematic GPU still sits with its 90nm process.

The 65nm drop for the GPU in the Xbox 360 revision codenamed Jasper isn’t expected until August, a time frame backed up by a report from CENS. Microsoft has contracted Taiwan Semiconductor Manufacturing Co. (TSMC), Advanced Semiconductor Engineering Inc. (ASE) and Nanya PCB Corp. to build the chips that will ship with the Jasper consoles later this summer.

TSMC will produce the 65nm chips, ASE will package and test them, and Nanya will supply the flip-chip packaging substrates. Microsoft has supposedly booked a production capacity at TSMC estimated to be at around 10,000 300mm wafers.

Inventory of the existing Falcon chips are reportedly depleted, paving the way for the transition to Jasper. The next step for the Xbox 360 console is dubbed “Valhalla,” which will integrate both the GPU and CPU in a single package as a cost-cutting measure, isn’t expected until a year after Jasper.



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By Fusible on 5/9/2008 3:45:08 PM , Rating: 2
Your dead wrong, the attach rate for 360 is 8.8 per year and PS3 thus far is 5.1 up to this point. Sure that will change, but so will 360's.


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