Intel Reveals 4 Watt "Diamondville" Processor Details
Gabriel Ikram & Kristopher Kubicki
February 27, 2008 3:43 PM
comment(s) - last by
Forget about 10 Watt processors; Intel's got plans for entire systems that fit in that thermal envelope
To quote Richard Feynman, "there's plenty of room at the bottom," and the microprocessor market is no exception. Although high performance is what captured Intel's attention for the past few years, the company is now aggressively targeting the low cost chip market, which holds immense potential and to this day remains largely uncultivated.
Intel’s most recent roadmap reveals more information about the company’s newest ultra-low cost, ultra-low voltage platform,
To set the record straight,
does not refer simply to low power CPUs, but in fact also refers to an entire platform. This is because
processors will come soldered directly onto specially designed boards.
According Intel partner roadmaps leaked to
line of processors are based on a completely new architecture drawn up on a “blank sheet of paper.” Intel plans to release two versions of its
processors, one for desktops and the other for mobile platforms.
chips are expected to be released towards the end of Q2’08. At this time, the company will launch the single-core
230, which is meant for desktop use, and the
-SC: 270, which is for use in mobile platforms. Both of these chips have very similar technical specifications, and will run at 1.60 GHz and feature 512KB cache.
Intel guidance suggests that the first dual-core
chips will launch under the Celeron 3xx SKU. These new chips are expected to be targeted for desktop use only and will make an appearance in Q3’08.
processors have a mere 4W to 8W thermal envelope, and are heralded for fan-less design. Intel also boasts that a number of its “leading ODM” partners support
, so we can expect to see plenty of new products developed based on these chips.
The success of products such as
ASUS’ Eee PC
has proven to companies that there is plenty of opportunity in the low cost market. Despite only offering modest technical specifications, the Eee PC has proven to be somewhat of a hit in the United States and not only in emerging markets as was expected prior to its release. Processors like
will help add growth to the low cost PC market not only abroad, but also in the United States.
Already the major notebook designers have realized that the bottom of the chip market is just as important as the top.
This article is over a month old, voting and posting comments is disabled
2/27/2008 10:53:22 PM
What...are you living under a bucket or something
I live in a giant bucket.
2/28/2008 8:23:54 AM
Tuesdays coming...did you bring a raincoat
I am the queen of france
My spoon is TOOO big!
"Intel is investing heavily (think gazillions of dollars and bazillions of engineering man hours) in resources to create an Intel host controllers spec in order to speed time to market of the USB 3.0 technology." -- Intel blogger Nick Knupffer
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