AMD's Fab roadmap

AMD's bullets for 65nm production
65nm on track, 45nm by mid-2008

AMD is expected to increase production capacity at their Dresden Fab by four times within the next three years. The details revealed in today’s AMD Technology Analysts Day emphasize the previous announcements of upgrades and transformations of Fab 30 (soon to be Fab 38) and Fab 36. With the increased production capacity of Fab 36 AMD expects production to ramp up to 25,000 wafers per month. As AMD moves away from 200mm wafer production, 300mm wafer production is expected to completely replace 200mm production around Q2’08.

DailyTech previously mentioned Fab 36 would lose its test facilities to make way for greater production capacity but new test facilities will be built in Singapore and Suzhou. In addition a separate, new test facility will also be built in Dresden. AMD's Daryl Ostrander released a bit of a roadmap (right) featuring some of the new details on facility upgrades in the near future.

As far as new fabrication processes go, 65nm qualification is on track with Revision G Brisbane core processors production ready, though the processor will not ship until the end of 2006. Replacing the 65nm SOI fabrication process is a new 45nm SOI process that is expected to be in production around mid-2008.  K8L is still being developed as a 65nm platform and expected for its initial release in 2007.

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