 Intel's USB "Cool Wall" (Source: DailyTech, Brandon Hill)
Intel discusses its plans for USB 3.0 technology
During Patrick Gelsinger's keynote at the Intel Developer
Forum (IDF) today, Intel made a small announcement regarding a group of
companies who are now working together to create a "superspeed personal
USB interconnect” with 10 times the speed of the current generation technology
of USB 2.0. The USB 3.0 Promoter Group -- which consists of Intel, Hewlett-Packard,
NEC Corporation, NXP Semiconductors, Microsoft and Texas Instruments -- looks
to make several other major changes.
Along with the 10x speed difference between USB 3.0 and the current generation,
the USB 3.0 Promoter Group is taking power consumption and better protocol
efficiency into consideration while designing 3.0. USB 3.0 will be able
to use the same architecture of wired USB, though no other specific details are
yet available.
To help drive home the importance of USB technology, Gelsinger pointed out the
usual USB devices everyday users have in their homes and offices: keyboards,
mice, speakers, cameras, etc. He also
introduced a number of novelty items that are powered by USB including refrigerators
and mittens.
"USB 3.0 is the next
logical step for the PC's most popular wired connectivity," said Jeff
Ravencraft, Intel technology strategist and USB Implementers Forum (USB-IF)
president. "The digital era requires high-speed performance and
reliable connectivity to move the enormous amounts of digital content now
present in everyday life. USB 3.0 will meet this challenge while maintaining
the ease-of-use experience that users have come to love and expect from any USB
technology."
Specific USB 3.0 specifications should be available sometime in the first half
of 2008.
"Intel is investing heavily (think gazillions of dollars and bazillions of engineering man hours) in resources to create an Intel host controllers spec in order to speed time to market of the USB 3.0 technology." -- Intel blogger Nick Knupffer
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