 Typical Prescott ball solder - Coutesy of Chipworks
 Copper pillar connection found on Presler and Yonah CPUs - Couresy of Chipworks
The first looks inside Yonah and Presler reveal some interesting techniques regarding the manufacturing process
Chipworks, a company that reverse engineers semiconductors, had the chance to crack open two of Intel's newest 65nm CPUs.
The company was excited to find that typical solder connections had
been completely replaced with copper pillar interconnects.
“Previous Intel processor generations such as the ‘Prescott’ used
conventional flip-chip technology with lead-tin (Pb-Sn) solder balls,”
adds Dick James,
senior technology advisor at Chipworks. “For the Yonah and Presler,
Intel has switched to a process that uses plated copper pillars to form
the interconnection between die and board. This reduces the lead
content over traditional flip-chip packaging even in the latest
“Pb-free” devices. This is the first processor seen by Chipworks to use
this advanced flip-chip technique.”
The move from solder to other lead-free manufacturing processes was
mandated by RoHS and other legislation in Europe several months
ago. However, Intel engineers seem to have gone beyond the
mandate by replacing solder altogether instead of just removing the
lead content.
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