With the main buzz about the next semiconductor process shift being to 45nm, Intel and TSMC are already gearing up the development of the 32nm node, reports DigiTimes. The article quotes Intel's director of technology strategy Paolo A. Gargini as saying that its development of the 32nm process is “in good shape.”
Gargini also said that Intel co-founder Gordon E. Moore’s Law is expected to hold true for the next 10 to 15 years. Immediate challenges to the Law, however, are expected to crop up as manufacturing moves towards 22nm. International Technology Roadmap for Semiconductors predicts that chips built on the 22nm process may not appear until 2015.
Furthermore, TSMC is supposedly running tests with the 32nm process, and CEO Rick Tsai revealed that the foundry has a team devoted specifically on developing 32nm technology.
To make transitions to more advanced processes possible, semiconductor companies have relied on new technologies such as three-dimensional packaging and multi-gate finFETs. Intel has also hinted it will start using tri-gate transistors on its 32 or 22nm products.
Looking at the immediate future, both Intel and TSMC confirmed that the 45nm technology it is developing is mature and that volume production will begin in the second half of 2007.